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Home Industry News Agilent Technologies announces collaboration with Hynix Semiconductor

Agilent Technologies announces collaboration with Hynix Semiconductor

14th January 2009

Agilent Technologies has worked with Hynix Semiconductor to develop a new long-wire zero insertion force (ZIF) probe tip, it has announced.

The product – which was noted as being high-performance and high-bandwidth by Agilent – has been optimised for graphics double data rate (GDDR) and double date rate (DDR) SDRAM validation.

Engineers will be able to take accurate measurements of high-speed signals, when probing signals found further apart using the long-wire ZIF tip. The option addresses "one of the basic challenges of DDR design", according to the company, by retaining signal integrity when probing hard-to reach locations on a DRAM chip.

"As the speed of DDR and GDDR SDRAM devices increases – and the design margins become smaller – the performance of the probing system becomes ever more critical," a statement from Agilent explained.

People in scientific sales may also be interested in Agilent Technologies Foundation recent announcement regarding $1.7 million (1.17 million pounds) of grants for the first half of its 2009 fiscal year. ADNFCR-1050-ID-18972059-ADNFCR

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