Rigaku’s Groundbreaking X-ray Technology Secures Prestigious Award

Rigaku Corporation has been honored with the esteemed Diana Nyyssonen Memorial Best Paper Award for its pioneering advancements in 3D flash memory inspection. Their ultra-high-resolution X-ray microscope technology presents a non-destructive method to detect defects, promising significant improvements in semiconductor manufacturing processes.

The award, presented at the SPIE Advanced Lithography + Patterning Conferences, highlights research excellence in measurement and inspection technology for semiconductor production. Rigaku’s technology stands out for its ability to offer unparalleled insight into complex 3D flash memory structures, notably tackling the persistent challenge in inspecting deeply embedded metal structures and memory holes. Traditional optical microscopes have limitations in resolution, which Rigaku’s X-ray solution surpasses by achieving detection limits that are ten times more refined. This revolutionary capability not only permits the detailed visualization of nanoscale structures but also ensures the integrity of the silicon substrate remains intact during examination.

Kazuhiko Omote, a prominent figure from Rigaku’s X-ray Research Laboratory, emphasizes that this technology could transform 3D flash memory production, enhancing yields and process efficiency. As Rigaku gears up for full-scale implementation within two years, this development marks a pivotal advancement in semiconductor technology, setting the stage for further innovations in multilayer device inspection and conductance measurement.

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