Agilent Technologies announces release date for Medalist platform

Agilent Technologies has announced its new Solder Paste Inspection (SPI) platform will be released on February 15th.

The Medalist SP50 Series 3 Dual Laser SPI solution is the fourth generation of SPI developed by the company and has defect coverage down to the 01005 level.

Customers – such as those in science sales jobs – who have to measure, inspect and test inline 3D solder paste for defects will find the Medalist useful, according to Agilent.

It has a dual laser configuration which improves coverage by removing shadowing effects which could be seen on a single-laser system, thus eradicating inconsistencies in the measurement accuracy.

"By adding the second laser, the SP50 has improved its inspection results by nearly 60 per cent on average compared to previous models," NK Chari, marketing director for Agilent’s Measurement Systems Division, commented.

Recently, the company announced the launch of a new online microarray design tool, the eArray 5.4.