3M partnership to provide lower cost packaging solutions

3M has announced a new partnership that could see a number of developments in the field of wafer bonding.

The company will work alongside SUSS MicroTec to enhance its current range of offerings and expand its plans for the provision of the high-volume manufacture of low-cost packaging solutions.

It is noted SUSS MicroTec will supply the 3M WSS system under the terms of the deal and will produce XBC300 and CBC300 wafer bonders for use with liquid UV-curable adhesives and light-to-heat conversion coatings.

Mike Bowman, marketing development manager for the firm’s electronics markets materials division, said the partnership could be fruitful for the company and its clients as a whole.

"The joint efforts of both companies provide 3M customers with improved support, lower overall costs and faster access to more advanced solutions," he added.

It was also announced this week that the group had seen its flexible pad diamond particle product revoked by the European Patent Office.